BASF Ultrafuse PA

Ultrafuse PA is suitable for a wide range of applications working within a larger temperature range than normal PA filament. BASF‘s Ultramid grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6/66. Ultramid is noted for its high mechanical strength, stiffness and thermal stability.

In addition, Ultramid offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.

With Ultrafuse PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special filaments can be created.

• Nozzle temperature: 220-250 °C
• Bed temperature: 90-120 °C
• Nozzle diameter: ≥ 0.4 mm
• Bed modification: Glas + PVA glue stick/ Kapton tape
• Print speed: 30-60 mm/s

BASF Quality ControlThe best raw materials available is selected from renowned suppliers. Production on state-of-the-art computer-controlled machinery guarantees a truly consistent filament, also between colors and batches. It will perform as expected every time.

All BASF products are 100% traceable to the source.