Description
Polydissolve
PolyDissolve™ is a family of dissolvable support filaments. This family offers support solution for Polymaker's portfolio of filaments. It enables a greater design freedom.
PolyDissolve S1PolyDissolve™ S1 is a preferable solution when printing complex geometries, overhangs, internal cavities and complicated structures. It liberates you from support removal problems, and enables greater design freedom.
Recommended Settings- Nozzle Temperature: 215˚C – 225˚C
- Printing Speed: 30mm/s – 40mm/s
- Bed Temperature: 25˚C – 60˚C
- Bed Surface: Glass with glue, blue tape
- Cooling Fan: ON
Note: It is highly recommended to use the PolyBox™ when printing with PolyDissolve™ S1 and to store it in the resealable bag.
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